Core Product Features
- Tempered Glass Base: Built with high-temperature resistant insulated glass to withstand direct heat gun exposure during desoldering.
- Three-Card Design: Features a triangular clamping structure with three-axis clamps to securely hold uniquely shaped motherboards.
- Bi-Directional Movement: Allows technicians to secure and work on a logic board and an individual IC chip simultaneously.
- Stepped Inward Bevel Clamps: Designed with an internal slanting mouth that bites into the motherboard edges for a slip-free grip.
- Honeycomb Heat Dissipation: Includes integrated structural venting to protect adjacent components and chips from heat damage.
- One-Click Self-Locking: Utilizes a quick slide-and-press locking mechanism to easily secure or release components.
Technical Specifications
- Brand: RF4 Focus Design
- Model Number: RF-FT11
- Compatibility: Works with 99% of smartphone, iPhone, and tablet motherboards.
- Primary Application: Motherboard repair, micro-soldering, IC chip replacement, and NAND/CPU reballing.
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