Core Technical Specifications
- Clamping Type: Dual-axis, independent sliding screw clamps (supports dual-board clamping simultaneously).
- Material Build: Thickened dual-layer heavy alloy base with non-slip pads.
- Temperature Resistance: Up to 500°C continuous exposure on synthetic stone components.
- Product Dimensions: Roughly 185mm x 87mm x 20mm.
- Weight: Approximately 0.6 kg for zero-shifting desk stability.
Key Features & Design Zones
- Dual Axis Linkage: Features independent horizontal and vertical sliding adjustments, allowing the fixture to match any unorthodox smartphone motherboard layout on the market (iPhone, Samsung, Xiaomi, etc.).
- Advanced Synthetic Stone: The clamping jaws and chip areas are engineered using advanced high-temperature synthetic stone. This prevents heat dissipation into the jig during intense hot air gun rework or reballing.
- Dedicated Chip Clamping Area: A specialised sliding IC slot area allows secure side-clamping for delicate CPUs, Nand flash chips, and hard disks during glue scraping or tin-planting.
- Battery Spot Welding Area: Includes a built-in vertical clamp layout specifically to stabilize battery flex cables and small protection circuit modules (BMS) for clean spot welding operations.
- Component Storage Slots: Integrated magnetic or regular small grooves into the synthetic stone panel for temporary organization of minute ICs and screws during disassembly.
Common Use Cases
- IC Reballing & De-Gluing: Securely holds chips stable without throwing off alignment under heavy mechanical scraping.
- Hot Air Rework: Absorbs high thermal stress safely up to 500°C when extracting surface mount devices.
- Jump Wire Repairs: Locks micro-circuits in position under the microscope to let the technician focus entirely on soldering iron precision.
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