- U-Shaped Glass Design: Features integrated tempered, insulated glass surfaces to protect surrounding components from heat dissipation during hot-air rework.
- Spring-Loaded Clamping: Utilizes a secure, spring-loaded mechanism that grips motherboards firmly without rebound or shifting.
- High Heat Resistance: Built to withstand direct exposure to soldering irons and hot-air rework stations without warping or transferring damaging heat.
- Anti-Skid Base: Equipped with a heavy-duty, special anti-skid pad underneath to prevent the entire fixture from sliding across the workstation.
- Universal Compatibility: Optimized for micro-level motherboard and logic board structures, making it highly compatible with iPhone series (including iPhone 6 through iPhone 14 models) and Android devices.
Primary Application.
- CPU & IC Reballing: Secures tiny microchips firmly in place during stencil positioning and tin-pasting.
- Jump Wire Repairs: Keeps the board perfectly still under a microscope while patching severed micro-traces.
- Component Desoldering: Acts as a reliable third hand to hold logic boards during high-heat component extraction.
Reviews
There are no reviews yet.