Main Functions and Features
- Magnetic Adsorption: Embedded strong magnets securely hold steel BGA stencils in place without shifting during the tin-planting paste application.
- No-Bulging Design: Features built-in heat dissipation paths underneath that prevent the metal stencil from buckling or bulging when heated by a hot air gun.
- Thickness Sorting: The three main labeled inner compartments (0.3mm, 0.5mm, 0.8mm) align with common smartphone IC chip thickness standards to keep components level.
- High-Temperature Resistance: Made from flexible, non-slip silicone that handles direct heat gun temperatures required for melting solder paste.
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