Core Technical Specifications
- Alloy Formulation: 63% Tin (Sn) / 37% Lead (Pb), which is a eutectic alloy that transitions instantly from liquid to solid state.
- Melting Temperature: 183°C (361.4°F), allowing safe component attachment without overheating sensitive ICs.
- Particle Dimension: Type 3 powder (25-45 microns), minimizing solder ball defects and bridging on fine-pitch stencils.
- Container Net Weight: 35 grams packaged inside a resealable plastic tub.
Key Benefits & Performance
- Strong Wetting Action: Infused with high-activity IPX3 flux to actively clear surface oxidation and guarantee bright, complete solder joints.
- Anti-Defect Consistency: Formulated to prevent false/fake welding, bridging, and stray solder balls under a hot air rework station.
- Extended Shelf Life: Resists drying out quickly during storage, though optimal consistency is preserved by keeping it sealed.
Storage & Handling Recommendations
- Temperature Control: Store between 0°C to 10°C (ideally inside a dedicated repair fridge) to avoid flux separation and premature aging.
- Usage Tip: Before applying it through stencils, let the tub sit at room temperature for 15-30 minutes and stir thoroughly to restore its smooth paste consistency.
- Health Notice: Because this contains lead (Pb), always use a smoke absorber/fume extractor and wash your hands thoroughly after handling.
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