Key Product Details
- Core Application: Designed primarily for CPU reballing, mobile phone IC (Integrated Circuit) repairs, BGA (Ball Grid Array), and SMD (Surface Mount Device) motherboard servicing.
- Melting Point: 217°C, which provides a stable thermal profile suitable for high-temperature lead-free components, ensuring robust and durable structural joints.
- Net Weight: 55g per container.
- Features Displayed:
- Oxidation resistance and long shelf life.
- Uniform consistency that prevents continuous continuous dripping or separation.
- Leaves low residue post-welding for cleaner circuit board finishes.
- Accompanied by a tin scraping knife/spatula for easy and precise stencil application.
Vendor and Contact Information
The promotional graphic is branded by Spogmai Mobile Zone Parts & Tools, a retail supplier specializing in mobile repair components and specialized tools. Contact and purchasing inquiries can be directed via the listed WhatsApp phone numbers featured on the flyer:
03429557277 and 03449643839
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