Key Technical Specifications
- Melting Point: 183°C (optimized medium temperature to safeguard temperature-sensitive components).
- Alloy Composition: Formulated with lead (Pb) and silver (Ag) for enhanced structural integrity.
- Form Factor Options:
- HW21: Standard 40g or 50g jar/pot packaging.
- HW21S: 10cc transparent syringe barrel, packaged with needle tips for direct, precise application.
- Shelf Life: Up to 12 months when properly stored in a refrigerated environment.
Performance & Mechanical Advantages
- No-Clean Formulation: Features a specialized flux base that leaves minimal, non-corrosive residue, eliminating the mandatory step of cleaning the PCB after rework.
- High Conductivity: The integration of silver noticeably decreases electrical resistance compared to standard leaded Sn63/Pb37 options.
- Excellent Wetting & Creep: Strong surface activity ensures bright, full solder joints while preventing common defects like bridge short-circuits or false/dry joints.
- Anti-Clumping Consistency: Maintained at a moderate humidity level to ensure smooth paste dispensing without dry agglomerations.
Primary Applications
- Mobile Phone Repair: Crucial for high-density smartphone logic board repairs, micro-soldering, and jumping broken traces.
- BGA Reballing: Perfectly suited for stencil-printing uniform solder balls onto IC chips like CPUs, power management ICs, and basebands.
- SMT & LED Patches: Ideal for precise surface-mount technology assembly and surface-mount LED repair configurations.
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