Key Specifications & Features
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- Form Factor: 10cc / 10ml syringe barrel, frequently distributed with a manual push rod for precise bead application
- Appearance: Completely pure and transparent gel paste that leaves a crystal-clear, non-conductive residue.
- No-Clean Formula: Designed to leave minimal, non-corrosive residue behind. It eliminates the strict requirement for post-solder washing, though residues can be easily wiped away with industrial alcohol if absolute aesthetics are required.
- Nanotechnology Composition: Compounded using 17 distinct organic extraction materials paired with nano-scale particles. This lowers the material surface tension and drives better capillary filling under low-clearance IC chips.
- Environmental Safety: Fully halogen-free, lead-free, and compliant with standard RoHS environmental protection metrics
- Operating Behavior: Formulated to produce exceptionally low smoke and a light, non-pungent odor compared to traditional rosin-based fluxes.
Ideal Applications
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- Mobile & Logic Board Repair: Highly favored for delicate jumper wiring, micro-soldering connectors, and fixing trace lines.
- BGA Reballing & IC Rework: Excellent fluid movement allows smooth solder ball formation on chips like CPUs, PMICs, and basebands.
- Oxidation Prevention: Acts as a thermal blanket that prevents oxidation during prolonged heat-gun exposure, avoiding cold solder joints.
Storage and Safety Guidelines
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- Temperature Control: Keep the syringe stored between 10°C to 25°C away from direct sunlight exposure.
- Ventilation: Always use a dedicated fume extractor or work in a highly ventilated area to prevent continuous inhalation of evaporated solvents.
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