Key Technical Specifications
- Thickness: Ultra-thin 0.23 mm profile allowing the edge to slide under tight smartphone frames without damaging components.
- Material: Premium carbon steel engineered for strong wear resistance, high structural flexibility, and minimal edge chipping.
- Blade Back Design: Features a reinforced safety spine that ensures stable fastening into standard scraper handles without snapping under pressure.
- Quantity: Typically packaged as a 100-piece box set.
Primary Applications
- Screen Separation: Sliding through tightly sealed borders to safely lift glass panels and LCD/OLED modules.
- Adhesive & OCA Cleaning: Scraping away leftover frame tape, black glue, and optical clear adhesive (OCA) residue from displays.
- Precision Cutting: General craft finishing, slicing thermal pads, or freeing small flex cables embedded in thick adhesive.
Alternative RELIFE Repair Series
If the TK3 does not quite fit your specific project requirements, you might want to look into other models in the same lineup:
- RELIFE TK2: A much thinner 0.09 mm double-sided stainless steel blade optimal for the tightest glass-gaps but with slightly lower rigid prying strength.
- RELIFE TX3: A non-magnetic chip prying needle kit meant for lifting motherboards, ICs, and delicate CPUs rather than surface scraping.
- RELIFE TK4 / TK5: Multifunctional multi-blade scraping and delamination sets featuring varying tip shapes for complex motherboard circuitry and black glue extraction.
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