Tool Functionality & Breakdown
The set features an integrated handle design that eliminates the need for separate blade attachments. It consists of 5 distinct tool shapes optimized for separate repair scenarios:
- Mode A: Designed for prying integrated circuits (IC) and CPU degumming.
- Mode B: Features a curved hook shape used as a corner cutter and for scraping peripheral glue around IC components.
- Mode C: A specialized flat-angled cutter for clean cuts and glue separating.
- Mode D: A straight, ultra-fine chisel point meant for prying hard disks and IC modules safely.
- Mode E: A slim flat blade intended for delicate CPU layer separation (delamination).
Technical Specifications
- Brand: Mechanic
- Heat Resistance: The integrated handles can withstand temperatures up to 300°C, making them perfectly safe to use alongside hot air rework stations.
- Application: BGA chip cleaning, underfill glue removal, and micro-component prying.
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