Technical Specifications
| Feature | Details |
|---|---|
| Capacity | 110ml (3.7 fl.oz) |
| Appearance | Transparent semi-fluid |
| Solid Content | 28% – 45% (varies by specific batch) |
| Hardness after Curing | 65-98A |
| Surface Dry Time | 3–6 minutes |
| Full Cure Time | 24–48 hours |
| Temperature Resistance | -35°C to +90°C |
Key Features
- Precision Applicator: Features a built-in needle design that prevents clogging and allows for controlled, mess-free application.
- Water & Vibration Resistant: Maintains a strong bond even in humid conditions or high-movement environments.
- Repair-Friendly: Its rubbery consistency when dry allows phones to be reopened later using heat without damaging the device.
- Multi-Surface Bonding: Effectively bonds glass, metal, plastic, leather, wood, ceramic, and electronic components.
Usage Instructions
- Preparation: Ensure surfaces are clean and dry. Perform a small-area test before applying to large sections.
- Application: Apply a thin layer to the surface. For best results, use at temperatures between 18°C and 32°C.
- Bonding: Wait 1–2 minutes before aligning and pressing the two parts together.
- Curing: Apply gentle pressure (e.g., using clips or weights) for at least a few hours. The bond reaches maximum strength after 48 hours.
- Storage: Store in a cool place (10°C to 28°C) and keep the cap tightly sealed to prevent the glue from drying out.
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