Key Product Specifications
- Thickness: 0.12mm square hole design for stable, anti-bulging solder paste application.
- Compatibility: Works across an array of Huawei power chips including Hi6421, Hi6422, Hi6522, Hi6523, Hi6553, and Hi6555.
- Material: Built using high-temperature resistant, super-hard Japanese steel to prevent shifting or deformation under heat gun contact.
Supported Integrated Circuits (ICs)
The stencil features specialized matrices labeled for individual Huawei power configurations:
- Top Row: Hi6555 V1, Hi6421 A V3, Hi6553 V1, Hi6551 V1, Hi6555 V2, Hi6559 V1
- Middle Row: Hi6921M V1, Hi6421GFC, Hi6421 V7, Hi6921 V1, Hi6421 V6, Hi6421 B V5
- Bottom Row: Hi6561 V1, Hi6422 V2, Hi6523 V1, Hi6522 V2, Hi6403 V1, Hi6422 V3, Hi6423 V1
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