Primary Purpose & Function
- BGA Reballing: Used to repair, replace, or upgrade standard Ball Grid Array (BGA) RAM chips.
- Tin Planting: Allows accurate alignment and precise application of uniform solder balls onto a chip’s contact pads.
- Prevents Bridge Shorting: Prevents accidental solder bridging between closely grouped pin lines during high-temperature reflow.
Core Technical Specifications
- Brand / Manufacturer: Amaoe
- Model Number: RAM-2
- Material: High-grade, heat-resistant stainless steel
- Thickness Options: Typically available in ultra-precise 0.12mm or standard 0.18mm sheets.
- Apertures: Precise, clean laser-cut holes designed to match the pin layouts perfectly without leaving burrs.
Supported Chipsets & Compatibility
The RAM-2 stencil features integrated layout patterns specifically spaced for multiple standard smartphone architectures and Ball Grid Array variations:
- Supported BGA Grid Layouts: BGA216, BGA168, BGA256, BGA136, BGA366, BGA556, and BGA272.
- Compatible Processor/RAM Architectures: Qualcomm Snapdragon platforms including MSM8992, MSM8956, and MSM8928 CPU top-floor RAM configurations.
Key Performance Benefits
- High Thermal Stability: Resists warping, bending, or bulging under direct heat gun exposure during soldering.
- Anti-Stick Properties: Ensures smooth paste release, leaving clean, equal-sized solder balls when pulled away.
- Corrosion Resistant: Easy to clean using standard PCB cleaners like Isopropyl Alcohol (IPA).
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