Key Features & Compatibility
- Thickness: Features a 0.12 mm thickness profile, which allows for uniform solder ball formation.
- Material: Made from high-quality steel designed to prevent warping under high heat from a soldering rework station.
- Supported Qualcomm ICs: Specifically formatted to align with various Qualcomm audio and wireless networking chips, including:
- Audio/Codec Chips: WCD9302, WCD9304, WCD9306, WCD9310, WCD9320, WCD9326, WCD9330, and WCD9340 / WCD9341.
- WiFi/Connectivity Chips: WCN3610, WCN3615, WCN3620, WCN3660, WCN3680, WCN3980, and WCN3990.
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