Key Features & Specifications
- Target Issues: Specifically formulated to clear up blurry images caused by microscopic dirt particles, fingerprints, oil stains, and internal moisture/watermarks.
- No-Disassembly Cleaning: Designed to clean the module efficiently in place, saving repair time and lowering the risk of hardware damage
- Safety Profile: It features a non-corrosive, rapid-volatilization (fast-drying), and residue-free formula that is completely safe for sensitive optical coatings and glass.
- Ultrasonic Compatibility: It is highly optimized for use inside ultrasonic cleaning machines to achieve a thorough, 360-degree deep clean.
- Available Sizes: Commonly sold globally in 500ml and 1000ml containers.
General Application Steps
- Module Prep: Unplug or separate the main camera module from the phone’s logic board.
- Submersion: Submerge the camera module directly into the RS180 MAX solvent (or inside an ultrasonic cleaner filled with the solvent) for 10 to 30 seconds.
- Drying: Place the module on a clean workbench and allow it to air-dry naturally for 3 to 5 minutes.
- Testing: Reinstall the module and power on the device to ensure the spots are completely gone.
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