Key Features and Specifications
- Precise Heating Zone: Features a specialized 18mm × 21mm workspace that isolates heat directly onto the target IC body. This design prevents collateral motherboard blistering, pad degradation, or neighboring component displacement.
- Adjustable Temperature: Supports continuous adjustment via its digital display screen with stable settings ranging from 160°C up to 250°C.
- Smart Power & Voltage Detection: Equipped with real-time digital tracking that features an integrated LED status indicator and 5V / 9V automatic switching detection.
- Hidden Telescopic Clamping: Utilizes an innovative, fully hidden retractable clamping structure. This design prevents fallen solder debris, scrapings, or glue residue from clogging the internal screw threads, extending the tool’s lifespan.
- Universal Compatibility: Fits 99% of mainstream smartphone chips, including mobile phone CPUs, basebands, hard drives, and Nand Flash components.
How to Use the Heat-Mini Station
- Clamping: Secure your IC chip into the adjustable clamping slot.
- Heating: Set your desired temperature (typically around 180°C – 200°C depending on the adhesive toughness).
- Cleaning: Once the platform stabilizes and the glue softens, gently brush away the adhesive residue using a stiff bristle mechanic brush—no air pressure or high heat guns needed.
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