Key Technical Specifications
- Construction: Made from high-quality stainless steel and double-layer synthetic stone material.
- Dimensions & Weight: 103 x 42 x 15 mm; weighs roughly 0.520 kg.
- Compatibility: Universal fit for iPhone, Samsung, and various Android motherboards and chips.
Core Features
- Dual-Shaft Stability: Features a rotary fixed design that prevents the motherboard or IC from shifting or rebounding during delicate soldering.
- 3-Level Adjustment: Built with three adjustable distances. To shift sizes, loosen the two bottom screws, move the fixing plate to the preferred gear, and retighten.
- Thermal Management: Equipped with an efficient built-in heat sink and a bottom anti-skid pad to accelerate heat dissipation from hot air guns.
- IC Degumming Support: The clamp absorbs the force of the IC beam, safely holding empty parts of the chip to prevent structural breakage while removing back glue.






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