Key Specifications & Features
- Broad iPhone Compatibility: Supports the middle frames and logic boards spanning from the iPhone 11 series all the way up to the iPhone 17 Pro Max.
- 30-in-1 Integrated Kit: Combines 30 interchangeable precision-positioning plates and specialized stencils into a single comprehensive kit.
- Universal Magnetic Base: Features a heavy-duty, high-strength magnetic base that automatically snaps the stencils into perfect alignment. This setup keeps the board 100% stationary during high-heat exposure.
- Thermal Shock Resistance: Constructed from premium, synthetic alloy and laser-cut stainless steel that effectively withstands direct heat guns during the tin-planting process.
- Full IC & Core Board Coverage: Includes dedicated alignments tailored for delicate core components including the CPU, NAND flash, Baseband, and PMIC structures.
Included Modular Components
The kit organizes specialized modules to fit designated generation classes.
- X to 11 Series Base Plates
- 12 / 12 Pro / 12 Pro Max Modules
- 13 Series Base & Stencil Set
- 14 Series Layer Plates
- 15 Series Pro / Max Plates
- 16 & 17 Pro Max Generation Fixtures.





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