Key Specifications & Features
- Melting Point: 138°C ultra-low melting threshold, ideal for temperature-sensitive parts.
- Packaging: Typically sold in 50g containers or syringes for controlled, easy application.
- Composition: A uniform mixture of high-purity granulated alloy powder and advanced flux.
- Residue: Formulated for low-residue performance, leaving behind non-corrosive, clean joints.
Primary Applications
- Middle Layer Board Separation: Perfect for safely rejoining or separating sandwiched motherboards (like modern iPhones) without overheating nearby ICs.
- CPU & BGA Reballing: Prevents thermal warping or blistering on delicate chips and logic boards.
- Plastic Connector Protection: Allows for soldering right next to fragile plastic FPC connectors without melting them.




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