Step-by-Step Usage Guide
- Preparation: Thoroughly clean the PCB using isopropyl alcohol to clear away old oils, flux, or dust.
- Application: Lay down your reballing stencil or use a fine-tipped tool to cleanly apply the paste onto the target pads.
- Reflow Heating: Set your hot air rework station between 160°C – 180°C. Move the nozzle evenly to allow the paste to liquefy and flow cleanly without splashing.
- Cleanup: Let the joint cool completely. Since this is a minimal-residue formula, cleanup is quick, but an additional pass with a flux cleaner ensures a flawless finish.






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