Key Product Details
- Core Application: Specifically optimized for prying delicate integrated circuit (IC) chips, splitting stacked double-decker CPUs, and scraping away stubborn edge glue or black vinyl without scarring the printed circuit board (PCB) surface.
- Material Integrity: Fabricated from high-rigidity, ultra-thin polished steel alloy that maintains optimal flexibility, giving technicians fine sensory feedback during tightly packed layer separation.
- Edge Geometry: Meticulously hand-sharpened to form a razor-sharp, taper-ground profile with excellent edge retention, allowing it to glide under microchips with minimal mechanical strain.
- Local Sourcing: Distributed in Swat Pakistan through specialized vendors like Spogmai Mobile Parts & Tools.





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