Key Features & Specifications
- Press-Type Quick Mechanism: Utilizes a quick-release, press-to-lock action for ultra-fast chip loading and unloading.
- High Stability & Precision: Offers a maximum clamping distance of 18.5mm, providing a secure grip for a wide variety of BGA IC chips, CPUs, NAND flash memory, and Wi-Fi modules.
- Circular & Ergonomic Form Factor: Features a compact circular footprint designed to be easily maneuvered under a repair microscope.
- Thermal Performance: Made from heat-resistant, high-density composite materials that resist structural warping and prevent heat loss during high-temperature hot air gun usage.
- Primary Use Cases:
- Motherboard logic board component repair.
- Scrubbing off black glue, underfill, and residual tin from IC chips.
- Steady positioning for precise jumper wire soldering.





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