Key Features
- Magnetic Hold: Features a powerful magnetic alignment system that securely locks BGA stencils in place. This guarantees zero stencil deviation and pinpoint precision during component reballing.
- Silicone Base: Equipped with a flat, non-slip silicone base that anchors the platform firmly to the workbench.
- Smooth Scraping: Built with a flat surface optimized for clean and uniform solder paste application.
- One-Shot Molding: Constructed via an integrated molding process to eliminate seams and streamline chip repair workflows.
- Included Accessories: The complete kit generally packages the magnetic reballing platform with designated beveled and flat tin scrapers.





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