Key Characteristics & Functions
- High Malleability (“Nano Foam” Properties): Unlike traditional rigid thermal pads, the KT-P3 features an ultra-soft, compressed foam-like consistency. This allows it to compress easily under low pressure, molding perfectly to uneven surfaces without warping delicate circuit boards.
- High Thermal Conductivity: It efficiently transfers heat away from microprocessors to prevent thermal throttling and hardware degradation.
- Electrical Insulation: The material is entirely non-conductive. It will not cause an electrical short circuit if it squeezes out and contacts surrounding motherboard components or pins.
- Gap Filling: It serves as an alternative to liquid thermal putty or variable-thickness pads, filling physical gaps ranging from fractions of a millimeter up to several millimeters depending on user application.
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