Key Features & Specifications
- Multi-Pitch Support: Features precise layouts covering 0.3mm, 0.35mm, 0.4mm, and 0.5mm pitches to fit a broad range of modern smartphone chips.
- High Thermal Resistance: Manufactured using ultra-high-temperature resistant steel to prevent warping, bulging, or deforming under hot air gun temperatures.
- Precise Alignment: Laser-cut grids enable exact positioning over IC chips (such as CPU, power ICs, and RAM components).
- High Flexibility: Engineered to bend slightly without losing structural form, facilitating easier chip detachment after tin paste application.





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