Key Features & Specifications
- High Temperature Resistance: Constructed with a heavy-duty tempered glass panel and insulated composite materials to survive direct heat from hot air rework stations.
- Extremely Firm Gripping: Features a 4-point stable clamping system that safely locks mobile phone circuit boards without warping or bending the PCB.
- Universal Design: Accommodates various smartphone mainboard shapes and sizes, making it highly versatile for gluing removal, soldering, and micro-soldering tasks.
- Scratch-Resistant Surface: The durable circular glass plate design guards the station against scratches, flux accumulation, and wear.
Primary Applications
- Soldering & Desoldering: Holds boards dead-still during high-heat components swaps.
- BGA Rework: Provides a flat, unyielding base for chip reballing and placement.
- IC Chip Glue Scraping: Keeps the motherboard steady under pressure while cleaning underfill adhesive.
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