Key Features & Specifications
-
- Brand & Model: MECHANIC SD360
- Capacity: 10cc syringe (packaged with a plunger/push rod for controlled, precise dispensing).
- No-Clean Formula: Halogen-free, leaving behind an ultra-low, non-corrosive, and non-conductive clear residue that does not require washing after application.
- High Transparency: The pure, transparent paste gives excellent visibility of solder joints and components during precision work.
- Excellent Fluidity: Offers high viscosity and instant wetting, helping components seamlessly align during chip reflow or BGA reballing.
- Environmentally Friendly: Formulated to generate low smoke and minimal odor while working.
Common Applications
This flux paste is optimized for high-density, fine-pitch electronics maintenance, including:
- Mobile phone motherboard and logic board repair
- SMD (Surface Mount Device) soldering
- BGA (Ball Grid Array) and IC chip reballing
- PCB track repair and micro-soldering tasks
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