Key Technical Specifications
- Power Supply: AC 220V / 50Hz
- Power Consumption: Approximately 550W – 580W
- Temperature Range: 100°C to 480°C (Adjustable via analog rotary dial)
- Airflow Delivery: Internal heavy-duty diaphragm compressor pump supplying steady, pulsation-free air pressure
- Maximum Airflow Capacity: Up to 120 L/min
- Housing: Robust, paint-coated metallic chassis featuring a built-in carrying handle
Core Hardware Features
- Magnetic Sensor Auto-Sleep: The machine features an intelligent magnetic induction handle. Placing the hot air wand back onto its dedicated side holster automatically triggers a cooldown cycle and transitions the machine into sleep mode, significantly extending the operational lifespan of the heating element.
- USB Interface Charging Port: The front panel includes a dedicated 5V USB output port, allowing technicians to power or test mobile devices directly from the station.
- Independent Dual Rotary Controls: Equipped with two precise front dials—one dedicated to regulating volumetric airflow velocity and the other to controlling the output temperature.
- Safety Integration: Fully grounded circuitry with ESD (Electrostatic Discharge) protection helps safeguard sensitive logic boards and microprocessors against unexpected thermal or static shock.
Primary Applications
- Micro-Soldering & Desoldering: Removing and installing delicate micro-components like resistors, capacitors, and multi-pin IC chips.
- BGA Reballing & Reflow: Ideal for fixing complex phone processors, power ICs, and baseband modules.
- Hardware Restoration: General hardware maintenance tasks including changing charging ports, repairing mobile phone speakers, or heat-shaping small plastic structural elements.
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