Key Features & Specifications
- Advanced Safety Formula: It features a halogen-free and lead-free formulation, significantly reducing harmful fumes and smoke emissions during soldering operations.
- No-Clean Residue: Formulated as a no-clean flux paste. It leaves behind non-conductive, non-corrosive minimal residue, eliminating the mandatory step of post-solder chemical cleaning.
- Superior Performance: Offers excellent wetting performance and high fluid dynamics, which aids in an even distribution of heat, faster tinning, and clean, bright solder connections.
- Applications: Ideal for high-precision micro-soldering tasks such as smartphone motherboards, BGA ICs, CPUs, PMICs, and eMMC/UFS flash memory chips.
- Packaging Package Contents: Packaged in a compact 10cc syringe design. It typically includes matching bayonet application needles and a piston plunger to avoid chemical waste and ensure controlled dispensing.
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