🛠️ Key Features & Specifications
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- Broad Device Compatibility: Available in sets matching original factory blueprints for Apple A-series processors ranging from A8 up to the A18 Pro (iPhone 6 to iPhone 16 series).
- High-Precision Alignment: Micro-perforated mesh ensuring every hole aligns perfectly with the underlying IC pads, preventing tin balls from getting stuck.
- Thermal Endurance: Constructed to comfortably withstand high temperatures up to 105°C without warping or discharging harmful emissions.
- Clean Insulation: Isolates trace scratches effectively to eliminate the risk of accidental short circuits during final reflow.
📖 Step-by-Step Application Guide
Follow these steps to safely insulate trace lines before reballing the BGA chip:
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- Prep the Logic Board: Thoroughly clean the motherboard or IC chip pad with PCB cleaner or isopropyl alcohol. Blast it with a hot air gun to guarantee it is entirely bone dry.
- Apply the Mask Ink: Use a fine razor blade to apply a paper-thin, completely uniform layer of UV-curable green oil solder mask over the damaged area. Smoothen it carefully to avoid trapping air bubbles.
- Seat the Green Oil Net: Place the Mechanic Green Oil Stencil with its printed side facing downward. Align the openings perfectly over the copper pads.
- UV Light Exposure: Shine a purple UV curing lamp directly over the setup for 6 to 15 seconds depending on the thickness of your layer.
- Strip & Final Cure: Gently lift the non-stick stencil away. Wipe off any uncured liquid residue on the pads using a lint-free cloth and PCB solvent. Blast it with the UV light one last time to fully harden the shell before proceeding to reball with your standard BGA reballing platform.
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