Key Product Features
- Ultra-Fast 3-Second Drying: Formulated for nearly instant curing, solidifying within 3 to 10 seconds under targeted UV illumination.
- High Chemical & Heat Resistance: Tolerates extreme temperatures up to 280°C, meaning it will not peel, crack, or melt when working nearby with hot-air rework stations later on.
- Excellent Surface Insulation: Forms a robust, non-conductive glossy barrier that prevents solder bridging and protects exposed copper from moisture.
- Optimal Spectrum Compatibility: Cures best when exposed to ultraviolet light wavelengths between 365 nm and 395 nm.
Pro-Tips for Application and Curing
- Surface Prep: Clean the target area thoroughly with Isopropyl Alcohol (IPA) before applying the mask to ensure the resin adheres permanently without peeling away.
- Apply Thin Layers: Avoid blobbing the mask heavily onto the board. Thick pockets of ink can cure on the outer surface while remaining wet and liquid underneath. If a thick layer is needed, build it up using multiple thin coats, curing each layer briefly in between.
- The “Hot Air” Trick: White and darker pigments sometimes struggle to absorb UV light evenly compared to clear coatings. If the paste is curing slowly, lightly blow hot air from your rework station (set around 270°C) alongside your UV torch. The resin will turn from a glossy/shiny look to a dull matte finish, signaling it is fully hardened
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