Key Specifications & Features
- Ultra-Fast Curing: Hardens instantly in just 3 seconds when exposed to a UV light source.
- High Insulation: Non-conductive resin material prevents accidental solder bridges and arcing.
- Smooth Finish: Delivers a durable, glossy protective layer that stays firmly attached to the board.
- Viscosity: Features a slightly fluid consistency that flows smoothly and can be easily spread out with a brush if a wider coat is needed.
Primary Applications
- Trace Repair: Covers exposed copper lines and repaired jumper wires securely.
- Solder Masking: Blocks off areas where you do not want solder to stick during micro-soldering.
- Component Stabilization: Anchors loose micro-components or pads to prevent them from lifting off during thermal stress.
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