Key Features & Technical Specifications
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- Dual-Sided, Dual-Thickness Architecture: The platform features two usable faces optimized for different device specifications. It comes with two baseline solder ball thickness recesses: T0.6 (geared for Apple devices) and T0.35 (geared for Android devices).
- Ultra-Strong Magnetic Alignment: Integrated high-power magnets secure the CPU and the stencil flush against each other. This prevents any shifting or displacement while applying solder paste or using a hot-air rework station.
- CNC Precision Engineering: The base is crafted via high-precision CNC machining to ensure a tight, perfect stencil fit, eliminating any gaps that cause solder bridging or uneven ball placement.
- Heat-Resistant Materials: Built from a heavy-duty, thermally stable alloy capable of enduring high-temperature reflow environments without warping or degassing.
Extensive Stencil Compatibility (75-Piece Set)
The full kit typically ships with an exhaustive 75-piece stencil set covering mainstream mobile architectures:
- Apple A-Series (12 Pcs): Comprehensive coverage spanning from older devices up to the latest chips, including the Apple A10 through the A19 / A19 Pro.
- Qualcomm Snapdragon (17 Pcs): Supports massive Android configurations including the SM8750 (Snapdragon 8 Ultra), SM8650, SM8550, and lower tier series.
- MediaTek (MTK), HiSilicon, & Exynos: Form-fitting stencils for Samsung Exynos configurations, Huawei HiSilicon silicon, and MediaTek chipsets.
- EMMC & RAM (12 Pcs): Includes specific templates for standalone memory IC packages such as BGA 153, 162, 186, 221, 254, and more.
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