The image shows the Mijing Z20 MAX, an all-in-one mid-layer motherboard reballing and tin planting platform. It is a professional hardware repair tool designed specifically for smartphone logic board diagnostic maintenance and BGA reballing.
Tool Functionality & Components
- Universal Strong Magnetic Base: A high-strength, magnetic base that securely positions the motherboard and automatically aligns the template stencils to prevent any movement.
- Series-Specific Planting Tin Modules: Interchangeable blue alignment blocks matched to specific logic board configurations from the iPhone X up to the 17 series.
- Intermediate Steel Mesh: High-temperature resistant, laser-cut stencils tailored for uniform solder paste distribution across the middle frame layers.
General Operational Steps
- Mounting: Place the series-specific planting tin module onto the magnetic base, then snap the corresponding iPhone logic board firmly into its slot.
- Alignment: Lay down the corresponding model-specific steel mesh stencil; the magnetic alignment pins will secure it in place.
- Solder Application: Apply BGA solder tin paste evenly across the open stencil grids using a scraping tool.
- Reflow Heat: Remove the stencil cover and use a hot air rework station to melt and solidify the solder points to separate or rejoin the layered logic boards
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