Key Technical Specifications
- Thickness: Optimized at 0.12mm for uniform, seamless solder paste application.
- Pitch Support: Broadly compatible with fine-pitch chips ranging from 0.3mm, 0.35mm, 0.4mm, to 0.5mm.
- Hole Design: Patented laser-cut round-square holes configured in both parallel and 45° orientations to prevent solder balls from getting jammed.
- Material: Manufactured using ultra-thin, heat-resistant, and high-tensile stainless steel that maintains its shape across multiple heating and cooling cycles
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