Key Specifications & Features
- Aperture Sizes: Includes multiple hole sizes (0.3mm, 0.35mm, 0.4mm, and 0.5mm) to accommodate varying chip pitches.
- Stencil Thickness: Features a precise 0.12mm thickness, which optimizes the exact amount of solder paste deposited to prevent bridging.
- Layout Varieties: Offers multiple hole orientations on a single sheet, including parallel grids, 45-degree angle grids, and rounded rectangles.
- Material Integrity: Built from high-grade, heat-resistant stainless steel that supports direct heat exposure without warping during the reflow process.
Core Repair Capabilities
- IC Chip Reballing: Provides a standard grid layout to evenly deposit solder paste on detached integrated circuits before fusing them back to the PCB.
- Device Compatibility: Operates as a universal grid solution for widely used chips including Qualcomm, MediaTek (MTK), Samsung, Huawei, and Xiaomi CPUs, RAM, and Power Management ICs (PMICs).
- Consistency: Ensures standardized alignment, minimizing over- or under-application of paste across repetitive repair jobs
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