Product Overview
- Dimensions: 2.0mm width and 80cm length.
- Material: High-quality pure copper wire with a plain geometric knitting pattern.
- Best Used For: Cleaning BGA pads, correcting circuit board errors, replacing components, and repairing mobile phones or motherboards.
Core Technical Features
- Rapid Heat Conduction: The geometric plain-weave braid ensures maximum thermal conductivity, melting solder instantly and minimizing the risk of heat damage to sensitive PCB pads.
- Strong Capillary Action: Specially optimized for powerful tin absorption, drawing up melted solder efficiently.
- Anti-Oxidation Coating: Refined with a unique chemical formula that resists oxidation and corrosion, ensuring long shelf life and stable performance during high-heat operation.
- Low Residue: Leaves minimal, non-conductive, and halide-free residue behind, eliminating the strict requirement for post-repair board washing.
Pro-Tips for Best Results
- Add Extra Flux: Though the wire is pre-treated, adding external flux to the joint vastly improves capillary action and speeds up heavy desoldering.
- Lift Simultaneously: Always lift your soldering iron tip and the copper braid away from the board at the exact same time. Lifting the iron first will instantly freeze the remaining solder and fuse the wick to the board, which can rip off delicate traces.
- Snip After Every Use: Clip off the spent, solder-filled portion of the braid after each step. Leaving used copper intact creates a giant heat sink that steals thermal energy away from your next target.
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