Key Product Specifications
- Melting Point: 183°C (361.4°F), which is the standard eutectic temperature ideal for reliable electronic connections.
- Weight/Capacity: 50g container or syringe.
- Model Number: RS183.
- Manufacturer: 2UUL Technology.
Primary Applications
- BGA Reballing: Specifically engineered for Ball Grid Array chip maintenance on smartphones and laptops.
- SMD Components: Perfect for surface-mount devices that require a highly precise flow and minimal bridges.
- PCB Motherboard Repairs: Widely used by micro-soldering technicians for clean, strong joints that resist false welding.





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