Key Features & Technical Specifications
- Rotary Locking System: Features a precise rotary shaft mechanism that locks motherboards or IC chips tightly into place. The lock is completely “no-rebound,” ensuring the clamp does not spring back or loosen during delicate microscopic soldering.
- High-Temperature Insulation: Crafted from high-grade tempered glass and synthetic composite materials that withstand operational temperatures up to 105°C without warping or releasing toxic, volatile fumes.
- Advanced Heat Dissipation: Features an integrated metal heat sink at the base of the clamp alongside ventilation paths. This design allows hot air from a rework station gun to discharge efficiently, protecting double-layer logic boards from overheating and delaminating.
- IC Glue Removal Beam Support: Specially designed to bear the downforce required during black glue or underfill scraping. It suspends and supports the hollow under-sections of microchips so they do not snap or crack under pressure.
- Multi-Gear Adjustable Distances: The fixture offers three tiered distance levels (high, middle, and low) to accommodate multi-sized mobile motherboards. Technicians can loosen two bottom-mounted alignment screws, adjust the gear position plate, and lock it down securely.
- Slip-Resistant Base: Equipped with custom anti-skid rubber feet on the bottom plate to prevent the heavy jig from shifting or sliding across your workbench while executing micro-soldering tasks.
Common Applications
- Securing multi-layer iPhone and Android sandwich motherboards.
- Cleaning or scraping resin/glue off large CPU, NAND, and baseband chips.
- Keeping microcomponents stable during jumper wire installations, trace repairs, and hot-air reflows.
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