Core Technical Specifications
- Material: Premium soft rubberized silicone providing elastic cushioning
- Heat Resistance: Withstands direct temperatures up to 500 °C without warping or bulging
- Integrated Chip Slots: Built-in multi-size slots including 0.3mm, 0.4mm, 0.5mm, and 0.8mm to fit various CPU, NAND Flash, and IC chips
- Dimensions: Compact 104mm × 80mm × 8mm footprint weighing 65.5g
Key Features & Repair Benefits
- Strong Magnetic Adsorption: Securely clamps down stainless steel BGA stencils, eliminating the risk of shifting or slipping during intensive solder paste application.
- U-Shaped & Curved Arc Design: Ergonomically fits the workspace for a seamless, hands-free stencil fit.
- Hollow Back Heat Dissipation: Features a specialized hollow ventilation drum design on the back. This spreads out extreme heat evenly and prevents thin steel stencils from expanding or bulging during heat gun work.
- Easy Maintenance: Anti-slip silicone material rejects solder stickiness and can be wiped clean with a soft microfiber cloth.
Primary Applications
- IC Reballing & Tinning: Accurately matches stencil grids to secure IC chips.
- Micro-Soldering Protection: Protects delicate logic board circuits from static and excessive thermal stress.
- Hardware Servicing: Optimizes workflow efficiency for phone repair technicians dealing with tiny, heat-sensitive micro-components.
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