Product Overview
- Product Name: 2UUL DA28 FlatCut
- Application: Specifically designed for cleaning residual underfill glue, epoxy, and black resin from mobile phone PCBs, CPU chips, and BGA IC solder pads.
- Safety Mechanism: Features a hand-polished, ultra-thin flat-cut profile engineered to reach narrow gaps under chips and scrape away glue safely without scratching the delicate circuit traces or separating solder pads.
Key Specifications
- Blade Dimensions: 37mm × 9mm × 0.5mm
- Material: High-hardness, wear-resistant stainless steel.
- Packaging: Sold in a protective plastic storage box containing 5 blades per pack.
- Handle Compatibility: Fully compatible with 2UUL standard precision blade handle systems (such as the 2UUL DA12 series).
Reviews
There are no reviews yet.