Key Specifications & Features
- Ultralight Handle: Built with an ergonomic, non-slip carbon fiber handle (often paired with the 2UUL DA29 Vajra Carbon Handle) that weighs only 15 to 22 grams to reduce hand fatigue.
- Micro-Point Needles: Includes two interchangeable high-precision pry pins/needles featuring ultra-fine, highly elastic sharp tips.
- 90° Rapid Springback: Crafted from a super-tough resilient alloy that features a 90-degree rapid rebound, allowing the needle to maintain its shape under repeated stress.
- Motherboard-Safe Layout: The needle geometry is engineered specifically to slide smoothly underneath fragile BGA IC chips without scratching the PCB pads or tearing traces.
Primary Micro-Repair Applications
- IC Chip Extraction: Cleanly separating and lifting BGA ICs, CPUs, and power management chips from the logic board.
- Glue & Underfill Removal: Scraping away tough resin underfill, black glue, or edge adhesive surrounding phone components.
- Tin Dragging & Leveling: Smoothing out and prepping solder pads before reballing a new component.
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