The RELIFE 12mm Oblique Nozzle is the largest standard size available in this 45° angled series, designed specifically for heavy-duty desoldering of massive motherboard modules under a microscope.
Primary Applications for the 12mm Nozzle
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- Large Shielding Cans: Quickly reflows the high-mass solder joints securing metal EMI shielding cages without warping the underlying board.
- Main CPUs and SOCs: Ideal for large smartphone processors (like Apple A-series or Snapdragon chips) and computer chipsets that require a massive volume of distributed heat for safe extraction.
- Large Baseband and Flash Memory: Efficiently heats large NAND flash storage chips or multi-layer PCBA power management blocks uniformly.Â
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