Key Applications for Qualcomm BGA Repair
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- Pad Isolation: Recreates the non-conductive green barrier between microscopic BGA pads if the original factory coating peels off.
- Short-Circuit Prevention: Ensures that when you apply solder paste and heat the Qualcomm chip, the molten balls do not bridge or shor Out underneath.
- Exact Drawing Alignment: Stencils are laser-cut precisely based on factory Qualcomm schematics (e.g., SM8450, SM8550, SM8650) so every single pin exposes a clean pad.
Step-by-Step Usage Guide
- Prep and Clean
Scrape away broken traces, clean the underlying chip or PCB pad area with alcohol, and dry it completely. - Apply the Green UV Mask
Spread a flat, parallel layer of liquid UV-curable green oil ink over the damaged pad region using a razor blade or small scraper. - Align the Net
Place the Qualcomm Green Oil Net (printed side down) squarely onto the wet ink, matching the holes up perfectly with your solder pads. - Flash with UV LigHT
Shine a UV curing lamp directly through the stencil mesh holes. The light hardens only the exposed green oil underneath the plastic shield to create walls around each pad. - Clean and Reball
Wipe away any unexposed, wet residual oil from the pin locations. Your copper pads are now securely isolated and ready for traditional BGA tin-pasting or reballing.
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