Key Technical Specifications
- Thickness: 0.12 mm precision laser-cut sheet.
- Material: High-grade, heat-resistant steel.
- Function: Aligns and applies solder paste onto microchips during hardware repairs.
Supported Broadcom IC Chips
This universal plate includes precise grid cutouts mapped for several common mobile Wi-Fi chip architectures:
- BCM4330 / BCM4334 / BCM4339
- BCM43340 / BCM43341
- BCM43438 / BCM43455
- BCM4354 / BCM4356
- BCM4773 / BCM4774 / BCM43596
- 0.4 x 18 x 18 general matrix configuration






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