The selected region displays an AMAOE BGA FaceID reballing stencil (V2.0) specifically designed for Apple iPhone repair technicians. This precision steel plate template features cutout arrays optimized for applying fresh solder balls onto the microscopic contacts of Face ID sensor components.
🛠️ Key Technical Specifications
- Brand/Manufacturer: Amaoe (阿毛易修)
- Application Focus: iPhone FaceID dot projector, flood illuminator, and infrared camera IC modules
- Thickness Profile: 0.12 mm square-hole design for uniform solder paste distribution
- Version Profile: V2.0 optimization iteration
💡 Core Product Features
- Anti-Bulging Structure: Built with high-temperature resistance to remain flat during direct heat gun exposure.
- Accurate Alignment: Precision CNC laser-cut holes line up seamlessly over underlying chip matrices.
- Component Markings: Includes Chinese technical labels designating exact positions for individual sensor chips.
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