Key Features & Technical Specifications
- Function: It is used to apply solder paste precisely onto the interposer/middle layer of sandwiched logic boards during motherboard separation and re-assembly repairs.
- Thickness: 0.12mm, providing the standard thickness required for uniform solder ball formation.
- Dimensions: 70mm × 70mm square profile.
- Property: Strong magnetic properties to assist with steady placement on compatible magnetic reballing bases







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