Key Product Specifications
- Brand: Amaoe (阿毛易修)
- Model/Series: HI:2 (Version 4.0)
- Thickness: 0.12 mm
- Function: Intermediate frequency (IF), audio, Wi-Fi, power, and baseband chip integrated mesh reballing.
- Compatibility: Explicitly designed for HiSilicon (Huawei) chipsets, including the following model numbers:
- HI6353, HI6363, HI6362, HI6361
- HI6402, HI6401
- HI1103, HI1101, HI1102
Technical Features
- Anti-Bulging Design: The plate features heat dissipation venting holes between the chip cutouts. This minimizes thermal expansion, warping, and bulging when applying high heat with a hot air rework station.
- Square Hole Matrix: Laser-cut square apertures help the solder balls release cleanly from the mesh after heating, reducing solder bridging.
Reviews
There are no reviews yet.