Technical Specifications
- Brand: Amaoe
- Model: HU2 (Huawei Hi CPU Series)
- Thickness: 0.12 mm optimized thickness to prevent solder ball bridging
- Material: Premium, anti-static laser-cut stainless steel mesh
- Dimensions: Compact and lightweight design for precise alignment handling
Targeted Chip & Processor Compatibility
The HU2 model features exact-fit aperture alignment dedicated to the following Huawei Kirin / HiSilicon (HI) series mobile processors and corresponding RAM chips:
- HI3660 (Kirin 960)
- HI6250 (Kirin 650 / 655 / 658 / 659)
- HI6220 (Kirin 620)
- HI6620
Primary Applications
- IC Chip Reballing: Restores grid solder array connections beneath damaged or unseated CPUs.
- Tin Plant Netting: Allows uniform, microscopic solder paste application through its precise laser-cut holes.
- High-Temperature Resistance: Features deformation-resistant properties under intense hot air gun reflow operations.
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