Key Product Details
- Purpose: This precision stencil template allows technicians to re-apply solder balls (reballing) onto complex Integrated Circuits (ICs).
- Thickness: Features a highly precise 0.12mm thickness for proper solder paste placement.
- Design Features: Built from durable alloy steel with a “superhard” construction. It incorporates unique cooling vent cutouts designed to prevent the stencil from warping or bubbling under heat.
Supported Chipsets
The layout supports reballing several generations of Huawei HiSilicon Kirin CPU platforms and corresponding RAM modules, specifically:
- HI6290 / L V1
- HI3690 5G / HI3690 CPU
- HI6280
- HI9500 V1
- HI3690 RAM
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